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【2024年】倒装芯片技术 flip chip technology英语短句 例句大全
倒装芯片技术,flip chip technology1)flip chip technology倒装芯片技术英文短句/例句1.Flip Chip technology is a typical application.倒装芯片技术就是其中一个典型应用。2.Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging倒装芯片技术...
2024-05-21
.../例句1.An Overview of Non destructive Inspection in Flip Chip Packaging倒装焊芯片封装中的非接触检测技术2.Research on welding fault during LED chips packagingLED芯片封装工艺中焊接缺陷研究3.Thermal Stress Analysis and Optimization of SCSP Chip Package叠层CSP芯片封...
2024-03-01
...ng from its backside.概述了一些关键的材料特性和封装尺寸对倒装片ＢＧＡ芯片裂纹的影响作用，从而断定基板厚度和芯片厚度是倒装片ＢＧＡ芯片发生裂纹的两个最重要的因素。6)chips[t?ips]芯片1.Surface Properties of GaAs IR LED Chips;GaAs红...
2024-02-21
气囊搬运技术 Gasbag transit technique英语短句 例句大全
...验研究5.An Overview of Non destructive Inspection in Flip Chip Packaging倒装焊芯片封装中的非接触检测技术6.Review of Shock-resistance Technology of Naval Ship for Underwater Non-contact Explosion舰船水下非接触爆炸抗冲击技术综述7.Hall noncontact measure technology in...
2024-03-07
